Solder bump analysis is the hottest topic in IC. Bowman’s new Bulletin #15 details a study demonstrating the efficacy of Bowman systems for quickly determining the composition of solder balls on IC interconnects.
Plating Bath Analysis used to be complicated, when the only options were titration, atomic absorption spectroscopy, and Inductively Coupled Plasma. No longer. High-accuracy results are now achievable with Bowman XRF techniques. Bulletin #16 describes how.
Demand for thick electroless nickel continues to grow. Bulletin 1.1 documents why Bowman XRF instruments are the industry’s best and highest-reliability option for determining the thickness and composition of these deposits.
Plating on plastics demands precise measurement of both base metal and top coating. There’s excellent info in Bulletin #17.
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