Our XRF coating thickness measurement systems measure these common IC package deposits:
- Solder Alloys
Precisely measures the composition and thickness of multiple layer coatings. Pinpoint control for critical area testing; multi-point programming for high throughput.
Large fixtures hold multiple samples for automated multi-point measurement. Well suited to flash gold plating, and applications involving 4+ plated layers.
Do you need to analyze less than 100μm features?
The Bowman O Series XRF delivers small feature analysis with exceptional accuracy; flux density gain up to 5 orders of magnitude compared to collimator. System is equipped with large window SDD.
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