Our XRF coating thickness measurement systems measure these common IC package deposits:
- Solder Alloys
Precisely measures the composition and thickness of multiple layer coatings. Pinpoint control for critical area testing; multi-point programming for high throughput.
Includes 7.5 µm optics and a high-res Silicon Drift Detector, which processes 2 million+ counts per second. High count rate capability is key to lowest MDL and highest spectral resolution.
Do you need to analyze features less than 100μm?
The Bowman O Series XRF delivers small feature analysis with exceptional accuracy; flux density gain up to 5 orders of magnitude compared to collimator. System is equipped with large window SDD.
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