A SERIES MICRO XRF

A Series Micro XRF

Bowman A Series Micro XRF System

The A Series Micro XRF was engineered for precise measurement of the smallest X-ray features found in semiconductors and microelectronics. It accommodates very large PCB panels, or wafers of any size for full sample coverage and multi-point programmable automation.

Bowman's A Series uses poly-capillary optics to focus the X-ray beam to 7.5 μm FWHM, the world's smallest for coating thickness analysis using XRF instruments. A 140X magnification camera is used to measure features on that scale; it is accompanied by a secondary, low magnification camera for live-viewing samples and birds-eye macro-view imaging. Bowman's dual-camera system lets operators see the entire part, click the image to zoom with the high-mag camera, and pinpoint the feature to be programmed and measured.

A programmable X-Y stage with movement of 23.6 in (600 mm) in each direction can handle the
largest samples in the industry. The stage has precision less than +/- 1 μm for each axis and is
used to select and measure multiple points; Bowman pattern recognition software and auto-focus
features also do this automatically. The system's built-in pattern recognition can be used to view the topography of a coating on a part such as a silicon wafer.

Questions? Want a Demo? Interested in a Trade-in?

The A Series XRF is exceptionally well suited to customers with these testing requirements:

  • Extremely small features on semiconductors, connectors, PCBs
  • Large PCB panels
  • Wafers of any size
  • Ability to process 2 million+ counts per second
  • Programmable X-Y stage with 23.6″ movement in each direction
  • 3D mapping capability
  • Compliance with IPC-4552 A/B, 4553A, 4554 and 4556,ASTM B568, DIN 50987 and ISO 3497
  • Cleanroom-ready

Product Specification

Element Range: Aluminium 13 to Uranium 92
X-ray excitation: 50 W Mo target Flex-Beam Capillary Optics @7.5 FWHM Optional: Cr or W
Detector: Large window Silicon drifted detector with 135eV resolution or better
Number of analysis
layers and elements:
5 layers (4 layers + base) and 10 elements in each layer. Composition analysis of up to 25 elements simultaneously
Filters/Collimators: 4 primary filters
Focal Depths: Fixed at 0.02″ (0.5mm)
Digital Pulse Processing: 4096 CH digital multi-channel analyzer with flexible shaping time. Automatic signal processing, including dead time correction and escape peak correction
Computer: Intel, CORE i5 9th Gen. Processor (4.1 GHz), 16GB RAM, Microsoft Windows 10 Prof, 64-bit
Camera optics: 1/4″ CMOS-1280×720 VGA resolution
Video Magnification: 140X Micro & 7X Digital Zoom: 9X Macro & Table View
Power Supply: 720W, 100~240 volts; frequency range 47Hz to 63Hz
Weight: 1000kg (2200 lbs)
Working Environment: 68°F (20°C) to 77°F (25°C) and up to 98% RH, non-condensing
Programmable XYZ: XYZ travel: 600mm (23.6″) x 600mm (23.6″) x 100mm (3.9″)
XY tabletop: 560mm (22″) x 585mm (23″)
X & Y-axis precision: 1um (40u”)
Z-axis precision: 1um (40u”)
Internal Dimensions: Width: 1400mm (55″), Depth: 1470mm (58″), Height: 100mm (4″)
External Dimensions: Width: 1470mm (58″), Depth: 1575mm (62″), Height: 1780mm (70″)
Other New Features: Z protection array, Auto focus, Focus laser, Pattern recognition, Semi S2 S8 compliant-ready

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