Bowman Hosts International XRF Event

Bowman held its 2017 International Sales Meeting in Chicago October 30 and 31, 2017

November, 2017 – 30 XRF coating measurement distributors from 15 countries attended the meeting, which provided an opportunity for our industry partners in both the printed circuit and general metal finishing industries to share ideas, discuss new technology developments, review best practices and celebrate the year’s many high-profile successes.

The culmination of the fast-paced 2-day meeting was an awards dinner where 2017 sales achievements were recognized. Recipients of Outstanding Achievement “Million Dollar” Sales Awards were Zach Dismukes, Bowman NA Sales Manager; Applied Scientific Instruments Co., Shanghai, China; and Quantum Equipment Co. Pvt. Ltd., Mumbai, India.

Zach Dismukes, Bowman NA Sales Manager; Arthur He, Applied Scientific Instruments Co., Shanghai, China; and DM Musale, Quantum Equipment Co. Pvt. Ltd., Mumbai, India received “Million Dollar” Sales Awards at Bowman’s 2017 International Sales Meeting.

Receiving $250,000 Sales Awards were CMI Korea, Seoul Korea; and Bowman Italia S.r.l., Novi Ligure, Italy.

According to Bowman President Tom Leone, the meeting was “a great success, with valuable participation by distributor partners, and excellent technical sessions.”

Bowman also recognized two of its presenters with awards for their contributions. Richard DePoto, Manager of Business Development at Uyemura USA, (Southington, CT) presented two talks. The first was an exploration of the IPC 4552 Rev. A ENIG Specification. The second was titled “White Bronze” Tri Metal: Expanding Applications and New Developments in a Changing Landscape. Frank Ferrandino, President of Calmetrics, Inc., (Ronkonkoma, NY) delivered a talk on standards and certification.

Among the topics most discussed at the meeting was the recent release of IPC-4552A: Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards. Bowman is distinct in that its systems guarantee compliance with this critical industry standard.

Bowman Honored with Export Challenge Award

August, 2017 – Bowman has received the prestigious Export Challenge Award. This honor is given by Metro Chicago Exports, a strategic economic development program that’s part of the Global Cities Initiative (a joint project of the Brookings Institution and JPMorgan Chase.) The award is made annually to companies who exhibit strong growth potential and have demonstrated an ability to succeed in international markets. The award ceremony was held July 25.

The Bowman system is a high performance, X-ray Fluorescence Analyzer, (“xrf”) widely used by OEMs and job shops in the printed circuit board industry, where plating thickness is a critical metric. XRF is also widely used in the automotive parts, plumbing and cutting tools industries.

Bowman XRF has grown 25% per year, on average for the past 5 years – a key reason for its selection by the Export Challenge judges. 70% of its product is exported, primarily to Asia. The company recently established a broad sales and service network in Germany.

In addition to manufacturing, Bowman provides calibration services, preventive maintenance and training worldwide. In March, 2017, Bowman XRF was honored by the international trade association IPC, (Association Connecting Electronics Industries, Bannockburn, IL) for its innovative technology in electronics assembly.

A new Bowman instrument that uses µ-spot capillary optics for advanced thin film measurement recently received the New Product Introduction Award from Printed Circuit Design and Fab and Circuits Assembly.

Bowman Wins NPI Award with M Series X-ray Optics System

Innovative technology combines a small spot, high flux x-ray beam with a large window Silicon Drift Detector (SDD) to achieve unmatched speed, precision and performance.

March, 2017 – Bowman’s M Series µ-spot optics instrument was honored with a New Product Introduction award during the IPC APEX Expo at the San Diego Convention Center. The award, presented by Circuits Assembly and Printed Circuit Design and Fab, was in recognition of the advanced thin film measurement the M Series achieves using µ-spot poly-capillary optics.

An independent panel of practicing industry engineers selected the recipients for this 10th annual award for electronics assembly equipment, materials, software, and PCB fabrication.“We are very excited that the M Series has received this recognition,” said Jun Choi, Bowman Chief Technology Officer. “The innovative technology combines a small spot, high flux x-ray beam with a large window Silicon Drift Detector (SDD) to significantly improve the instrument’s speed, precision and performance.”