XRF for Printed Circuit Boards

PCB coating thickness analysis has been Bowman's specialty since the company's foundation as CMI in the 1980s.

Bowman guarantees that ALL of its XRF systems meet and exceed the gage capability requirements defined in IPC-4552 and IPC-4556. Bowman systems exclusively use silicon drift detector (SDD) technology for the best all-around performance.

P Series with base

P Series

Programmable XY stage (travel from 5”x6” to 16”x16”), multiple collimators (4, 8, 12, 24mil default, customized options available), slotted chamber to accommodate panels of all sizes. SDD detector standard; large-window SDD optional for fastest test times.

B Series

B Series

Fixed base for manual feature positioning, single collimator (multi-collimator assembly optional), slotted chamber to accommodate panels of all sizes. SDD detector standard; large-window SDD optional for fastest test times.

Learn more about our compliance and performance data for IPC 4552, and about PCB testing using XRF.

Check out our short Application Bulletin below to see how Bowman meets IPC-4552, IPC-4556 and measures %P under Au in ENIG: