PCB coating thickness analysis has been Bowman’s specialty since the company’s foundation as CMI in the 1980s.
Bowman guarantees that ALL of its XRF systems meet and exceed the gage capability requirements defined in IPC-4552 rev A&B. Bowman systems exclusively use silicon drift detector (SDD) technology for the best all-around performance.
SDDs provide the best resolution, lowest noise level (highest S/N ratio), long-term stability, and shortest test times. They also measure %P directly in electroless nickel deposits. Combined with Bowman’s highly reliable x-ray tube, this hardware duo represents a solid core in every XRF system we offer.
Whether you’re measuring ENIG, ENEPIG, HASL, electroless nickel, %P, RoHS, or another PCB application, Bowman has the perfect solution for your requirements. With a full range of models and hardware options, our experts can help identify the best fit for your needs.
The two most popular models for PCB analysis are the P and B Series systems. The P Series includes a multi-collimator assembly to accommodate a variety of pad sizes and a variety of programmable XY stage sizes and travel ranges. The B Series is the most affordable option and offers the same measurement performance of the P Series, without the programmable stage or multiple collimator sizes.
If your feature sizes approach 100 µm or smaller, Bowman offers poly-capillary optics systems which combine a very small x-ray beam size with high flux levels. As collimator sizes decrease, the amount of x-rays (flux) decreases in tandem. This directly affects repeatability and increases the required test times to achieve acceptable results. Poly-capillary optics offers the most effective solution for very small features, and Bowman offers beam sizes down to 7.5 µm FWHM, the smallest in the industry.
Programmable XY stage (travel from 5”x6” to 16”x16”), multiple collimators (4, 8, 12, 24mil default, customized options available), slotted chamber to accommodate panels of all sizes. SDD detector standard; large-window SDD optional for fastest test times.
Fixed base for manual feature positioning, single collimator (multi-collimator assembly optional), slotted chamber to accommodate panels of all sizes. SDD detector standard; large-window SDD optional for fastest test times.