Calibration Standards for Semiconductors / Wafers

XRF Standards

Bowman supplies reference standards for precisely calibrating any XRF coating thickness and elemental analysis system.

We provide single-layer foils in every common thickness variant, for aluminum, cadmium, chromium, cobalt, copper, gold, iron, indium, lead, nickel and electroless nickel, palladium, platinum, rhodium, silver, tantalum, tin, titanium, and zinc.

Au/Pd/Ni (Gold/Palladium/Nickel) 3 layer foils
Au Pd Ni
µin µm µin µm µin µm
0.14 0.004 0.25 0.006 30 0.8
0.4 0.01 1 0.025 80 2
1 0.025 5 0.13 200 5
Au/Pd/Ni-P (Gold/Palladium/Electroless Nickel) “ENIPIG” 3 layer foils*
Au Pd Ni
µin µm µin µm µin µm
2 0.05 4 0.1 150 3.8
* %P is nominally 8% and not certified
Au-Ag/Pd/Ni (Gold-Silver alloy/Palladium/Nickel) 3 layer foils
AuAg Pd Ni
µin µm %Au %Ag µin µm µin µm
0.5 0.013 50 50 0.6 0.015 40 1
1.2 0.03 50 50 1.5 0.038 100 2.5
2.5 0.06 50 50 2.4 0.06 160 4
Au/Ag/Pd/Ni (Gold/Silver/Palladium/Nickel) 4 layer foils
Au Ag Pd Ni
µin µm µin µm µin µm µin µm
0.2 0.005 0.4 0.01 0.4 0.01 20 0.5
0.4 0.01 4 0.1 3 0.07 80 2
0.8 0.02 20 0.5 8 0.2 160 4
Ag (Silver) Foils
μin μm
2 0.05
4 0.1
10 0.25
20 0.5
40 1
80 2
100 2.5
150 3.8
200 5
300 7.5
400 10
500 12.5
600 15
800 20
1200 30
1500 37.5
2000 50
Au (Gold) Foils
μin μm
2 0.05
4 0.1
10 0.25
20 0.5
30 0.8
40 1.0
50 1.3
60 1.5
70 1.8
80 2
100 2.5
120 3
150 3.8
200 5
250 6.3
300 7.5
Cu (Copper) Foils
μin μm
4 0.1
10 0.25
20 0.5
40 1.0
100 2.5
200 5
300 7.5
400 10
500 12.5
700 17.5
800 20
900 22.5
1100 27.5
Ni (Nickel) Foils
μin μm
2 0.05
4 0.1
10 0.25
20 0.5
30 0.8
40 1
50 1.3
60 1.5
80 2.0
100 2.5
120 3
150 3.8
200 5
250 6.3
320 8
400 10
500 12.5
600 15
700 17.5
800 20
900 22.5
1000 25
1200 30
Ni-P (Electroless Nickel) foils Non-Certified Phosphorus*
μin μm %P %Ni
100 2.5 4 96
200 5 4 96
400 10 4 96
550 13.8 4 96
600 15 4 96
80 2 8 96
100 2.5 8 96
200 5 8 96
250 6.3 8 96
300 7.5 8 96
400 10 8 96
600 15 8 96
700 17.5 8 96
125 3.1 12 88
250 6.3 12 88
330 8.3 12 88
450 11.3 12 88
* For Ni-P with certified wt%P see Alloy foils.
Pd (Palladium) foils
μin μm
2 0.05
4 0.1
10 0.25
20 0.5
40 1
60 1.5
80 2
120 3
200 5
Sn (Tin) foils
μin μm
4 0.1
10 0.25
20 0.5
40 1
80 2
200 5
400 10
600 15
800 20
900 22.5
1200 30
1600 40
2400 60
3000 75
Ag/Ni (Silver/Nickel) 2 layer foils
Ag Ni
µin µm µin µm
45 1.1 90 2.3
45 1.1 200 5
45 1.1 400 10
160 4 200 5
160 4 400 10
Au/Ni (Gold/Nickel) 2 layer foils
Au Ni
µin µm µin µm
2 0.05 100 2.5
4 0.1 60 1.5
4 0.1 100 2.5
4 0.1 160 4
4 0.1 240 6
10 0.25 60 1.5
10 0.25 300 7.5
10 0.25 350 8.8
20 0.5 30 0.8
20 0.5 80 2
30 0.8 30 0.8
30 0.8 60 1.5
40 1 100 2.5
40 1 230 5.8
40 1 400 10
60 1.5 120 3
80 2 120 3
80 2 300 7.5
90 2.3 180 4.5
100 2.5 200 5
Au/Ni-P (Gold/Electroless Nickel) 2 layer foils*
Au NiP
µin µm µin µm
2 0.05 120 3
4 0.1 240 6
20 0.5 80 2
30 0.8 30 0.8
30 0.8 60 1.5
40 1 200 5
40 1
80 2
* – nominal electroless nickel composition is 92% Ni 8 %P
Au/Pd (Gold/Palladium) 2 layer foils
Au Pd
µin µm µin µm
10 0.25 40 1
10 0.25 100 2.5
30 0.8 40 1
30 0.8 100 2.5
30 0.8 150 3.8
Au/Ag (Gold/Silver) 2 layer foils
Au Ag
µin µm µin µm
30 0.8 100 2.5
30 0.8 400 10
100 2.5 100 2.5
100 2.5 130 3.3
100 2.5 425 10.6
Ni/Cu (Nickel/Copper) 2 layer foils
Ni Cu
µin µm µin µm
200 5 200 5
200 5 500 112.5
300 7.5 300 7.5
500 12.5 200 5
Rh/Ni (Rhodium/Nickel) 2 layer foils
Rh Ni
µin µm µin µm
5 0.13 125 3.1
7 0.18 200 5
10 0.25 100 2.5
10 0.25 240 6
10 0.25 400 10
15 0.38 100 2.5
15 0.38 200 5
15 0.38 400 10
20 0.5 300 7.5
Sn/Ni (Tin/Nickel) 2 layer foils
Sn Ni
µin µm µin µm
50 1.3 150 3.8
50 1.3 400 10
180 4.5 150 3.8
180 4.5 400 10
Au-Ag (Gold-Silver) foils
µin µm %Au %Ag
40 1 40 60
100 2.5 40 60
150 3.8 40 60
240 6 40 60
2 0.05 50 50
4 0.1 50 50
40 1 60 40
150 3.8 60 40
240 6 60 40
40 1 80 20
100 2.5 80 20
150 3.8 80 20
240 6 80 20
2 0.05 90 10
4 0.1 90 10
Au-Cu (Gold-Copper) foils
µin µm %Au %Cu
40 1 40 60
100 2.5 40 60
150 3.8 40 60
240 6 40 60
40 1 60 40
100 2.5 60 40
150 3.8 60 40
240 6 60 40
40 1 65 35
120 3 65 35
40 1 80 20
100 2.5 80 20
150 3.8 80 20
240 6 80 20
Au-Sn (Gold-Tin) foils
µin µm %Au %Sn
80 2 80 20
120 3 80 20
200 5 80 20
320 8 80 20
400 10 80 20
500 12.5 80 20
800 20 80 20
Cu-Sn (Copper-Tin) foils
µin µm %Cu %Sn
1000 25 95 5
2000 50 95 5
Cu-Zn (Copper-Zinc) foils
µin µm %Cu %Zn
100 2.5 63 37
200 5 63 37
500 12.5 63 37
Ni-P (Electroless Nickel) foils Non-Certified Phosphorus*
μin μm %P %Ni
100 2.5 4 96
200 5 4 96
400 10 4 96
550 13.8 4 96
600 15 4 96
80 2 8 96
100 2.5 8 96
200 5 8 96
250 6.3 8 96
300 7.5 8 96
400 10 8 96
600 15 8 96
700 17.5 8 96
125 3.1 12 88
250 6.3 12 88
330 8.3 12 88
450 11.3 12 88
*Non-certified wt%P standards can be found under Single layer Foils.
Sn-Ag (Tin-Silver) foils
µin µm %Sn %Ag
160 4 40 60
520 13 40 60
200 5 60 40
500 12.5 60 40
70 1.8 90 10
100 2.5 90 10
200 5 90 10
520 13 90 10
100 2.5 97 3
200 5 97 3
500 12.5 97 3
8000 20 97 3
Sn-Ag -Cu (SAC) foils
µin µm %Sn %Ag %Cu
200 5 95 4 1
600 15 95 4 1
Sn-Bi (Tin-Bismuth) foils
µin µm %Sn %Bi
160 4 40 60
520 13 40 60
200 5 60 40
500 12.5 60 40
70 1.8 90 10
100 2.5 90 10
200 5 90 10
520 13 90 10
100 2.5 97 3
200 5 97 3
500 12.5 97 3
800 20 97 3
Sn-Cu (Tin-Copper) foils
µin µm %Sn %Cu
200 5 95 5
400 10 95 5
800 20 95 5
200 5 99 1
400 10 99 1
Sn-Pb (Tin-Lead) foils
µin µm %Sn %Pb
40 1 60 40
80 2 60 40
150 3.8 60 40
200 5 60 40
250 6.3 60 40
350 8.8 60 40
400 10 60 40
600 15 60 40
1000 25 60 40
1500 38 60 40
100 2.5 80 20
200 5 80 20
250 6.3 80 20
500 12.5 80 20
2700 17.5 80 20
60 1.5 90 10
100 2.5 90 10
200 5 90 10
250 6.3 90 10
350 8.8 90 10
450 11.3 90 10
550 13.8 90 10
700 17.5 90 10
100 2.5 97 3
200 5 97 3
400 10 97 3
500 12.5 97 3
800 20 97 3
100 2.5 99 1
200 5 99 1
400 10 99 1
500 12.5 99 1
Sn-Zn (Tin-Zinc) foils
µin µm %Sn %Zn
650 16.3 20 80
480 12 30 70
320 8 40 60
200 5 70 30
400 10 70 30
400 10 92 8
Ni-P/Cu (Electroless Nickel/Copper) Certified Phosphorous*
µin µm %P %Ni
150 3.8 8 92
300 7.5 8 92
400 10 8 92
500 12.5 8 92
700 17.5 8 92
1000 25 8 92
60 1.5 10 90
80 2 10 90
100 2.5 10 90
140 3.5 10 90
130 3.3 12 88
230 5.8 12 88
350 8.8 12 88
450 11.3 12 88
1200 30 12 88
*Non-Certified %P standards can be found under Single Layer Plated
Sn-Ni/Cu (Tin-Nickel/Copper)
µin µm %Sn %Ni
375 9.4 62 38
520 13 62 38
100 2.5 65 35
240 6 65 35
200 5 70 30
300 7.5 70 30
450 11.3 70 30
800 20 70 30
Sn-Pb/Cu (Tin-Lead/Copper)
µin µm %Sn %Pb
40 1 60 40
80 2 60 40
100 2.5 60 40
120 3 60 40
150 3.8 60 40
200 4 60 40
300 7.5 60 40
350 8.8 60 40
400 10 60 40
500 12.5 60 40
600 15 60 40
800 20 60 40
900 22.5 60 40
1000 25 60 40
40 1 90 10
60 1.5 90 10
80 2 90 10
100 2.5 90 10
150 3.8 90 10
200 4 90 10
250 6.3 90 10
300 7.5 90 10
350 8.8 90 10
400 10 90 10
450 11.3 90 10
600 15 90 10
700 17.5 90 10
800 20 90 10
1000 25 90 10

XRF Calibration Standards and Certification

PCB shops, and semiconductor manufacturers across North America trust Bowman’s decades of experience in precision x-ray testing to assure the accuracy of their measurements. Bowman supplies single foil XRF calibration standards for all XRF equipment and applications.

With XRF analyzer certification, we calibrate and certify your XRF equipment to NIST* standards, and also certify your current reference standards.

XRF calibration procedures are performed in-house at Bowman’s ISO/IEC 17025 Accredited Lab.

*National Institute of Standards and Technology

Calibration / Recertification Services