XRF for Semiconductors / Wafers

Bowman is the Premier Manufacturer of World Class, American-Made XRF Instruments for Semiconductor Applications

No industry has evolved more than semiconductor devices. Consumer demands for smaller, faster, cheaper, and more reliable devices require constant redesigns. Bowman has adapted and refined its strategies to meet these demands.

SDD Detectors

Intuitive, Feature-rich Software

The software interface is what allows operators to get the most from an XRF system. Operators have multiple tasks to perform, and struggling with a complicated test protocol shouldn’t slow them down. Bowman developed software with the operator in mind – and it makes all the difference!

  • Industry’s most intuitive user interface. Designed to minimize errors, it is icon-driven, with customizable shortcut keys, flexible data display and output, and a one-click report generator.
  • Full feature access without restrictions. The full software suite is provided standard with each system. It provides unlimited access for creating new applications or recipes; no added software required.
  • Coating thickness, alloy ID, and solutions analysis capabilities are built into ALL Bowman systems to maximize XRF’s analytical capacities. Measure up to 5 coating layers, 30 elements in any layer, and even identify the alloy grade for metal sorting. Plating bath solution analysis is a fast way to measure concentration without dilution, digestion, or titration.
  • Data management for secure and organized reporting. All data is automatically saved with a time and date stamp. Data is stored locally and can be manually or automatically exported to a network folder, SECS/GEM, or SPC system. Customizable Excel-based report templates and searchable database allows data to be retrieved and presented easily.
  • Laser auto focus is the fastest on the market. Z axis achieves focus position in less than a second, preventing sample misplacement between operators. This feature can be applied to multi-point programs to adjust for warpage on the fly.
  • Pattern recognition capability ensures perfect beam centering on very small features. Feature images are stored and matched with stage position adjustments, allowing truly automated programming with precise measurement locations.