Solder Bump Analysis

Analyzing SAC, SnAg, and Other Solder Bumps

Bowman XRF optics systems are versatile analytical tools for compositional analysis of small solder bumps, as well as plating thickness and composition and plating solution analysis. The reduced costs of time, personnel, and instrumentation required by other methods make Bowman XRF an excellent alternative.

Read our short solder bump Application Bulletin to learn more.