Literature

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Many of the application briefs and journal articles listed here reference IPC 4552 capability. All Bowman XRF systems are fully IPC 4552 – 4556 capable, including all current revisions.

Bowman Brochure Semiconductor Brochure IC Substrates Brochure Standards Flyer Bowman RoHS Brochure K Series Collimated Flyer K Series Optics Flyer A Series Flyer W Series Flyer L Series Flyer M Series Flyer O Series Flyer P Series Flyer B Series Flyer G Series Flyer Bowman Application Brief on IPC-4552 Application Bulletin 1.2 - Performance on Thin and Thick Electroless Nickel Plating Application Bulletin 2.1: ENEPIG IPC-4556 Application Bulletin 3.1 - Measurement of ENIG %P Under the Au Layer Application Bulletin 4 - Compliance of Bowman XRF Instruments with IPC-4552 Application Bulletin 5 - Au/Ni/Kovar Application Bulletin 6 - Thickness Measurement of Sn and Ni Layers on Resistors and Capacitors Application Bulletin 7 - Nanometer Level Indium Coating Thickness Measurement for the Automobile Industry Application Bulletin 8.1 - Measurement of Ni-Cu-Ni In the Magnet Industry Application Bulletin 9 - Composition & Thickness Measurement of Zn-Ni Alloy Coatings Application Bulletin 10 - Termination Plating Analysis of Capacitor - Resistor and Inductor Application Bulletin 11 - Analyzing TiCN Coating Thickness on Cutting Tools Application Bulletin 12 - Identifying Hazardous Substances as Defined in the RoHS 3 Directive Application Bulletin 13.1 - Analyzing Physical Vapor Deposition (PVD) Coating Thickness Application Bulletin 14 - Thickness Analysis Of Chromate Conversion Coatings Application Bulletin 15: Solder Bump Analysis Application Bulletin 16: Multi-Element Solution Analysis Application Bulletin 17: Coatings on Plastic Substrates Application Bulletin 18: Coatings on Glass Substrates Application Bulletin 19: Platinized Anodes (Pt/Ti) Application Bulletin 20: Rhodium Plating on Gold Alloys for the Jewelry Industry Application Bulletin 21: Failure Analysis of Pb-Free and High Reliability Solders Application Bulletin 22: Polycapillary Optics for Semiconductor Industry Applications Application Bulletin 23: Tin Electroplating over Copper Alloys with Common Elements Project Profile: PCI - Bowman P Series XRF Chosen by Leader in Rigid Flex & Multilayer Boards Projects Profile - Kintech - Ten Long - Bowman Taiwan Proves O Series Superiority for PCB Quality Testing Quality Magazine - The Right Detector - April 2020 Quality Magazine - XRF Analysis: What Labs and Lines Really Want - April 2019 Quality Magazine - With XRF Measurement the Goal is Achieving Low Limits of Detection Precisely and Fast Customer Insights - KEMET Electronics

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K Series Collimated Flyer A Series Flyer XRF Serie G Flyer XRF Serie B Flyer XRF Serie P Flyer XRF Serie O Flyer XRF Serie M Flyer XRF Serie L Flyer XRF Serie W Flyer Fluorescenza A Raggi X Per L’analisi Dei Rivestimenti Bowman Italia Opuscolo Semiconductor Brochure

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Bowman Brochure RoHS Broschüre Halbleiter Broschüre Flyer der K-Serie A-Serie Flyer Flyer der B-Serie Flyer der G-Serie L-Serie Flyer Flyer der M-Serie O-Serie Flyer P-Serie Flyer W-Serie Flyer Applikationsbericht 1 - Chemisch-Nickel-Beschichtungen DEPra Technik Service Flyer Bowman RFA Appliaktionsbericht 1 Bowman RFA Appliaktionsbericht 2 Bowman RFA Appliaktionsbericht 3.1 Bowman RFA Appliaktionsbericht 4 Bowman RFA Appliaktionsbericht 5 Bowman RFA Appliaktionsbericht 6 Bowman RFA Appliaktionsbericht 7 Bowman RFA Appliaktionsbericht 8 Bowman RFA Appliaktionsbericht 9 Bowman RFA Appliaktionsbericht 10 Bowman RFA Appliaktionsbericht 11 Bowman RFA-Applikationsbericht 12

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K Series Collimated Flyer A Series Flyer Bowman Brochure W Series Flyer L Series Flyer O Series Flyer P Series Flyer B Series Flyer P Series Flyer G Series Flyer Application Bulletin 1.1 – Performance on Thin and Thick Electroless Nickel Plating Application Bulletin 2 – ENEPIG Applications Application Bulletin 3.1 – Measurement of ENIG %P Under the Au Layer Application Bulletin 4 – Compliance of Bowman XRF Instruments with IPC-4552 Application Bulletin 5 – Au/Ni/Kovar Application Bulletin 6 - Thickness Measurement of Sn and Ni Layers on Resistors and Capacitors Application Bulletin 7 – Nanometer Level Indium Coating Thickness Measurement for the Automobile Industry Application Bulletin 8 – Measurement of Ni-Cu-Ni In the Magnet Industry Application Bulletin 9 – Composition & Thickness Measurement of Zn-Ni Alloy Coatings Application Bulletin 10 – Termination Plating Analysis of Capacitor – Resistor and Inductor Application Bulletin 11 – Analyzing TiCN Coating Thickness on Cutting Tools Projects Profile – Bowman Taiwan Proves O Series Superiority for PCB Quality Testing Project Profile: PCI – Bowman P Series XRF Chosen by Leader in Rigid Flex & Multilayer Boards Quality Magazine – The Right Detector – April 2020 Quality Magazine – XRF Analysis: What Labs and Lines Really Want – April 2019 Quality Magazine – With XRF Measurement the Goal is Achieving Low Limits of Detection Precisely and Fast Semiconductor Brochure

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K Series Collimated Flyer Bowman Brochure Bowman RoHS Brochure Semiconductor Brochure A Series Flyer W Series Flyer L Series Flyer M Series Flyer O Series Flyer P Series Flyer B Series Flyer G Series Flyer Bowman Application Brief on IPC-4552 Application Bulletin 1.2 - Performance on Thin and Thick Electroless Nickel Plating Application Bulletin 2.1: ENEPIG IPC-4556 Application Bulletin 3.1 - Measurement of ENIG %P Under the Au Layer Application Bulletin 4 - Compliance of Bowman XRF Instruments with IPC-4552 Application Bulletin 5 - Au/Ni/Kovar Application Bulletin 6 - Thickness Measurement of Sn and Ni Layers on Resistors and Capacitors Application Bulletin 7 - Nanometer Level Indium Coating Thickness Measurement for the Automobile Industry Application Bulletin 8.1 - Measurement of Ni-Cu-Ni In the Magnet Industry Application Bulletin 9 - Composition & Thickness Measurement of Zn-Ni Alloy Coatings Application Bulletin 10 - Termination Plating Analysis of Capacitor - Resistor and Inductor Application Bulletin 11 - Analyzing TiCN Coating Thickness on Cutting Tools Application Bulletin 12 - Identifying Hazardous Substances as Defined in the RoHS 3 Directive Project Profile: PCI - Bowman P Series XRF Chosen by Leader in Rigid Flex & Multilayer Boards Projects Profile - Kintech - Ten Long - Bowman Taiwan Proves O Series Superiority for PCB Quality Testing Quality Magazine - The Right Detector - April 2020 Quality Magazine - XRF Analysis: What Labs and Lines Really Want - April 2019 Quality Magazine - With XRF Measurement the Goal is Achieving Low Limits of Detection Precisely and Fast Customer Insights - KEMET Electronics

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K Series Collimated Flyer A Series Flyer Broszura Bowman Ulotka Bowman Serii W Ulotka Bowman Serii L Ulotka Bowman Serii M Ulotka Bowman Serii O Ulotka Bowman Serii P Ulotka Bowman Serii B Ulotka Bowman Serii G Ulotka serwisowa Bowman Anitepo Semiconductor Brochure

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K Series Collimated Flyer A Series Flyer Bowman Brochure Bowman RoHS Brochure W Series Flyer L Series Flyer M Series Flyer O Series Flyer P Series Flyer B Series Flyer G Series Flyer Bowman Application Brief on IPC-4552 Application Bulletin 1.2 - Performance on Thin and Thick Electroless Nickel Plating Application Bulletin 2.1: ENEPIG IPC-4556 Application Bulletin 3.1 - Measurement of ENIG %P Under the Au Layer Application Bulletin 4 - Compliance of Bowman XRF Instruments with IPC-4552 Application Bulletin 5 - Au/Ni/Kovar Application Bulletin 6 - Thickness Measurement of Sn and Ni Layers on Resistors and Capacitors Application Bulletin 7 - Nanometer Level Indium Coating Thickness Measurement for the Automobile Industry Application Bulletin 8.1 - Measurement of Ni-Cu-Ni In the Magnet Industry Application Bulletin 9 - Composition & Thickness Measurement of Zn-Ni Alloy Coatings Application Bulletin 10 - Termination Plating Analysis of Capacitor - Resistor and Inductor Application Bulletin 11 - Analyzing TiCN Coating Thickness on Cutting Tools Project Profile: PCI - Bowman P Series XRF Chosen by Leader in Rigid Flex & Multilayer Boards Projects Profile - Kintech - Ten Long - Bowman Taiwan Proves O Series Superiority for PCB Quality Testing Quality Magazine - The Right Detector - April 2020 Ingeniería De Superficies -En El Análisis Por Fluorescencia De Rayos El Objetivo Principal Es Obtener Unos Límites Bajos De Detección Con Precisión Y Rapidez Quality Magazine - XRF Analysis: What Labs and Lines Really Want - April 2019 Quality Magazine - With XRF Measurement the Goal is Achieving Low Limits of Detection Precisely and Fast Customer Insights - KEMET Electronics

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