The M Series is the ultimate in high performance plating thickness measurements for the smallest features. The poly-capillary optics in the M Series is more advanced than the O Series, focusing the x-ray beam down to7.5μm FWHM. To measure features on that scale, a 140x magnification camera with an even higher digital zoom is included. The field of view becomes more restricted with higher magnification, so a second camera takes a macro-image of the part to be measured. The dual-camera system allows operators to see the entire part, click the image to zoom in with the high-mag camera, and pinpoint the feature to be measured.

The high-precision programmable X-Y stage can be used to select and measure multiple points; the pattern recognition software can also do this automatically. There is a 2-D mapping system that can be used to see the topography of a coating over the surface area of a part such as a silicon wafer.

The standard configuration includes the 15μm optics, and a high resolution LSDD detector to process the higher count rates. A programmable X-Y sample stage is also standard. The optics system has a close focal distance, so samples measured with the M Series must be flat.

Now available with extended stage option