XRF for Electronic Components

Our XRF coating thickness measurement systems are ideally suited to connectors, heat sinks, battery components and other electronic components.

As electronic devices proliferate, manufacturers must keep pace with faster, more reliable, and less costly electrical components. Bowman worked closely with electronics fabricators and their plating shops to engineer a suite of benchtop XRF instruments that quickly and precisely measure parts of all shapes and sizes.

P Series

Sample chamber dimensions 12”x13”x5.5” (WxDxH). Includes programmable XY stage (travel from 5”x6” up to 16”x16”) and multiple collimators (4, 8, 12, 24mil default, customized options available).

L Series

Sample chamber dimensions 22”x24”x11” (WxDxH). Includes programmable XY stage (travel 10”x10”) and multiple collimators (4, 8, 12, 24mil default, customized options available).

Application Bulletin 3.1:
Measuring %P under Au plating

Application Bulletin 3.1

An important study focuses on the requirement to measure % phosphorus in a nickel-phosphorus layer under gold. Precise measurement is critical in the fabrication of printed circuit boards to guard against oxidation and enhance the solderability of copper contacts and plated vias and thru-holes.