Our XRF coating thickness measurement systems are ideally suited to connectors, heat sinks, battery components and other electronic components.
As electronic devices proliferate, manufacturers must keep pace with faster, more reliable, and less costly electrical components. Bowman worked closely with electronics fabricators and their plating shops to engineer a suite of benchtop XRF instruments that quickly and precisely measure parts of all shapes and sizes.
Electronic components continue to miniaturize, so it's critical to address decreasing feature sizes. This means that the x-ray beam must be small enough to focus on very small areas. Bowman offers a range of collimator sizes; for the smallest components, there are several poly-capillary optics alternatives ranging from 7.5-80 µm FWHM.
Bowman also offers a range of chassis and sample stage sizes to accommodate a broad range of part sizes and testing volumes. Many of our customers work with very small parts such as pin connectors, and also measure multiple samples per lot of parts. Often, custom fixtures present small samples to the XRF system.
All Bowman XRFs allow multi-point programs to be created, saved, and recalled to automate testing for multiple parts. A programmable XY stage, and built-in pattern recognition software makes high volume testing efficient and consistent.
Bowman systems use exclusively silicon drift detector (SDD) technology. SDDs offer the best resolution, lowest noise level (highest S/N ratio), long-term stability, and shortest test times. They can also measure %P directly in electroless nickel deposits. Combined with Bowman's highly reliable x-ray tube, this hardware combination is a key reason why our benchtop XRFs deliver the best all-around performance and reliability.
Electronic component testing requirements vary to the degree that it's difficult to identify one model that would be most beneficial. Visit our products page, use our contact form, or call us, and one of our specialists can recommend the most advantageous instrument for your test environment and budget.
Sample chamber dimensions 12”x13”x5.5” (WxDxH). Includes programmable XY stage (travel from 5”x6” up to 16”x16”) and multiple collimators (4, 8, 12, 24mil default, customized options available).
Sample chamber dimensions 22”x24”x11” (WxDxH). Includes programmable XY stage (travel 10”x10”) and multiple collimators (4, 8, 12, 24mil default, customized options available).
Application Note 3.1 : Measuring %P under Au plating
An important study focuses on the requirement to measure % phosphorus in a nickel-phosphorus layer under gold. Precise measurement is critical in the fabrication of printed circuit boards to guard against oxidation and enhance the solderability of copper contacts and plated vias and thru-holes.