XRF for Electronic Components

Our XRF coating thickness measurement systems are ideally suited to connectors, heat sinks, battery components and other electronic components.

As the proliferation of electronic devices continues to trend upward, manufacturers must keep pace with faster, more reliable, and less costly electrical components. Bowman works closely with electronics fabricators and their plating shops and has designed a suite of XRF instruments for precisely and quickly measuring parts of all shapes and sizes.

P Series

Sample chamber dimensions 12”x13”x5.5” (WxDxH). Includes programmable XY stage (travel from 5”x6” up to 16”x16”) and multiple collimators (4, 8, 12, 24mil default, customized options available). SDD detector standard on both models; large-window SDD optional for fastest test times.

L Series

Sample chamber dimensions 22”x24”x11” (WxDxH). Includes programmable XY stage (travel 10”x10”) and multiple collimators (4, 8, 12, 24mil default, customized options available). SDD detector standard; large-window SDD optional for fastest test times.

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